Lead Free Design - RoHS

October 2005

The EU RoHS commission has passed a decision on the first batch of exemptions.

The exemptions pertain to lead and cadmium in special circumstances where suitable replacement technologies are not available or viable.

Here are the approved exemptions:

• Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead)
• Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signaling, transmission as well as network management for telecommunications
  Lead in electronic ceramic parts (e.g. piezoelectronic devices)
• Cadmium and its compounds in electrical contacts and cadmium plating except for applications banned under Directive 91/338/EEC
• Lead used in compliant pin connector systems
• Lead as a coating material for the thermal conduction module c-ring
• Lead and cadmium in optical and filter glass
• Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80 % and less than 85 % by weight
• Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages

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This is for EU RoHS only.  China RoHS has no exemptions for restricted materials or device categories like Medical and Telecom